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Thermal Pad Thermal Grizzly Minus Pad 8 - 100 × 100 × 2,0 mm
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4 installments 0% επιτόκιο, 20€ έως 300€
3 to 60 installments 300€ έως 100.00€
- 1. Ship with ACS Courier
- 2. Αποστολές με μεταφορικές εταιρίες για ογκώδη αντικείμενα
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3. Pickup from BoxNow automated machine:
Με την BoxNow μπορείς να παραλάβεις το δέμα σου από Αυτόματο Μηχάνημα Παραλαβής που βρίσκεται κοντά σου, όλες τις ώρες της ημέρας 24/7. Η υπηρεσία έχει χρέωση 3€. Υπάρχει δυνατότητα αντικαταβολής με επιπλέον χρέωση 1€.
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4. Pickup from the store:
Leof. El. Venizelou 73 (former Theseos), Kallithea
Συμπληρώστε τον ταχυδρομικό κωδικό για να λάβετε εκτίμηση τρόπου και κόστους μεταφορικών.
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The Thermal Grizzly Minus Pad 8 - 100 × 100 × 2.0 mm is a cutting-edge thermal interface pad crafted for superior heat transfer efficiency in electronic devices such as CPUs, GPUs, and memory modules.
This pad boasts an exceptionally elastic and compressible surface made from a unique ceramic-silicone mixture, enhanced with nano-aluminum oxide fillers. This composition ensures optimal heat transfer under various conditions, including minimal pressure and small component gaps.
- Electrically Insulating: Up to 8 kV/mm per ASTM D149
- Eco-Friendly: Compliant with RoHS standards
- Flammability: Rated V-0, enhancing safety standards
- Softness: Shore 00-60 hardness
The available thicknesses range from 0.5 mm to 3 mm, with this specific pad measuring 2.0 mm thick.
Technical Specifications
- Thermal Conductivity: 8.0 W/mK, ideal for high-performance applications
- Operating Temperature Range: -100°C to +250°C, ensuring extreme stability
- Dimensions: 100 × 100 × 2.0 mm
- Specific Weight: 3.3 g/cm³
- Hardness: Shore 00-60 for high compressibility
- Thermal Resistance: ~0.625 K/W (general)
Designed for filling gaps in uneven surfaces, this pad requires only light pressure for effective attachment, thus supporting custom cutting for different components.
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Thermal Conductivity8.0 W/mK
-
Operating Temperature Range-100°C to +250°C
-
Dimensions100 × 100 × 2.0 mm
-
Specific Weight3.3 g/cm³
-
HardnessShore 00-60
-
Electrical InsulationYes (8 kV/mm)
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FlammabilityV-0
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Thermal Resistance~0.625 K/W
Ratings
Description
The Thermal Grizzly Minus Pad 8 - 100 × 100 × 2.0 mm is a cutting-edge thermal interface pad crafted for superior heat transfer efficiency in electronic devices such as CPUs, GPUs, and memory modules.
This pad boasts an exceptionally elastic and compressible surface made from a unique ceramic-silicone mixture, enhanced with nano-aluminum oxide fillers. This composition ensures optimal heat transfer under various conditions, including minimal pressure and small component gaps.
- Electrically Insulating: Up to 8 kV/mm per ASTM D149
- Eco-Friendly: Compliant with RoHS standards
- Flammability: Rated V-0, enhancing safety standards
- Softness: Shore 00-60 hardness
The available thicknesses range from 0.5 mm to 3 mm, with this specific pad measuring 2.0 mm thick.
Technical Specifications
- Thermal Conductivity: 8.0 W/mK, ideal for high-performance applications
- Operating Temperature Range: -100°C to +250°C, ensuring extreme stability
- Dimensions: 100 × 100 × 2.0 mm
- Specific Weight: 3.3 g/cm³
- Hardness: Shore 00-60 for high compressibility
- Thermal Resistance: ~0.625 K/W (general)
Designed for filling gaps in uneven surfaces, this pad requires only light pressure for effective attachment, thus supporting custom cutting for different components.
Technical Specifications
-
Thermal Conductivity8.0 W/mK
-
Operating Temperature Range-100°C to +250°C
-
Dimensions100 × 100 × 2.0 mm
-
Specific Weight3.3 g/cm³
-
HardnessShore 00-60
-
Electrical InsulationYes (8 kV/mm)
-
FlammabilityV-0
-
Thermal Resistance~0.625 K/W
