The Thermal Grizzly Minus Pad 8 - 100 × 100 × 2.0 mm is a cutting-edge thermal interface pad crafted for superior heat transfer efficiency in electronic devices such as CPUs, GPUs, and memory modules.

This pad boasts an exceptionally elastic and compressible surface made from a unique ceramic-silicone mixture, enhanced with nano-aluminum oxide fillers. This composition ensures optimal heat transfer under various conditions, including minimal pressure and small component gaps.

• Electrically Insulating: Up to 8 kV/mm per ASTM D149
• Eco-Friendly: Compliant with RoHS standards
• Flammability: Rated V-0, enhancing safety standards
• Softness: Shore 00-60 hardness

The available thicknesses range from 0.5 mm to 3 mm, with this specific pad measuring 2.0 mm thick.

Technical Specifications

• Thermal Conductivity: 8.0 W/mK, ideal for high-performance applications
• Operating Temperature Range: -100°C to +250°C, ensuring extreme stability
• Dimensions: 100 × 100 × 2.0 mm
• Specific Weight: 3.3 g/cm³
• Hardness: Shore 00-60 for high compressibility
• Thermal Resistance: ~0.625 K/W (general)

Designed for filling gaps in uneven surfaces, this pad requires only light pressure for effective attachment, thus supporting custom cutting for different components.