The Xilence CPU Thermal Pad XZ028 is engineered to deliver exceptional heat transfer from CPUs to cooling solutions, ensuring effective cooling and safeguarding sensitive hardware. Ideal for gamers and tech enthusiasts, this thermal interface material is user-friendly and straightforward in its application.

One of the key advantages of the Xilence CPU Thermal Pad is its excellent thermal conductivity of 22.5 ± 0.1 W/m·K. This feature guarantees that heat is transferred efficiently between CPU and cooling elements.

Other technical highlights include:

• Thermal Impedance: Less than 0.011 °C-in²/W, demonstrating minimal resistance to heat flow.
• Heat Resistance: 0.29 K/W, contributing to superb thermal management under load.
• Density: 2.6 g/cc, providing a balance of softness and durability.
• Operating Temperature Range: -40 °C to 125 °C, perfect for standard CPU environments.
• Storage Temperature Range: -50 °C to 250 °C, ensuring stability during long-term storage.
• Dimensions: 38 x 38 x 0.25 mm, designed to comfortably fit standard CPU surfaces.
• Weight: Approximately 44 grams per package, ensuring it’s lightweight and easy to handle.
• Warranty: 12 months, providing peace of mind regarding product reliability.

This thermal pad is classified under Xilence's cooling components, specifically tailored for CPUs. Its advanced thermal properties not only help maintain stable CPU temperatures but also enhance the longevity of hardware components.

In conclusion, the Xilence CPU Thermal Pad XZ028 is an indispensable choice for anyone seeking a reliable and high-performance solution for heat dissipation, coupled with straightforward application and solid thermal performance specifications.