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Thermal Pad Xilence CPU Thermal Pad
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4 installments 0% επιτόκιο, 20€ έως 300€
3 to 60 installments 300€ έως 100.00€
- 1. Ship with ACS Courier
- 2. Αποστολές με μεταφορικές εταιρίες για ογκώδη αντικείμενα
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3. Pickup from BoxNow automated machine:
Με την BoxNow μπορείς να παραλάβεις το δέμα σου από Αυτόματο Μηχάνημα Παραλαβής που βρίσκεται κοντά σου, όλες τις ώρες της ημέρας 24/7. Η υπηρεσία έχει χρέωση 3€. Υπάρχει δυνατότητα αντικαταβολής με επιπλέον χρέωση 1€.
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4. Pickup from the store:
Leof. El. Venizelou 73 (former Theseos), Kallithea
Συμπληρώστε τον ταχυδρομικό κωδικό για να λάβετε εκτίμηση τρόπου και κόστους μεταφορικών.
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The Xilence CPU Thermal Pad XZ028 is engineered to deliver exceptional heat transfer from CPUs to cooling solutions, ensuring effective cooling and safeguarding sensitive hardware. Ideal for gamers and tech enthusiasts, this thermal interface material is user-friendly and straightforward in its application.
One of the key advantages of the Xilence CPU Thermal Pad is its excellent thermal conductivity of 22.5 ± 0.1 W/m·K. This feature guarantees that heat is transferred efficiently between CPU and cooling elements.
Other technical highlights include:
- Thermal Impedance: Less than 0.011 °C-in²/W, demonstrating minimal resistance to heat flow.
- Heat Resistance: 0.29 K/W, contributing to superb thermal management under load.
- Density: 2.6 g/cc, providing a balance of softness and durability.
- Operating Temperature Range: -40 °C to 125 °C, perfect for standard CPU environments.
- Storage Temperature Range: -50 °C to 250 °C, ensuring stability during long-term storage.
- Dimensions: 38 x 38 x 0.25 mm, designed to comfortably fit standard CPU surfaces.
- Weight: Approximately 44 grams per package, ensuring it’s lightweight and easy to handle.
- Warranty: 12 months, providing peace of mind regarding product reliability.
This thermal pad is classified under Xilence's cooling components, specifically tailored for CPUs. Its advanced thermal properties not only help maintain stable CPU temperatures but also enhance the longevity of hardware components.
In conclusion, the Xilence CPU Thermal Pad XZ028 is an indispensable choice for anyone seeking a reliable and high-performance solution for heat dissipation, coupled with straightforward application and solid thermal performance specifications.
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Thermal Conductivity22.5 ± 0.1 W/m·K
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Thermal ImpedanceLess than 0.011 °C-in²/W
-
Heat Resistance0.29 K/W
-
Density2.6 g/cc
-
Operating Temperature Range-40 °C to 125 °C
-
Storage Temperature Range-50 °C to 250 °C
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Dimensions38 x 38 x 0.25 mm
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WeightApproximately 44 grams per package
-
Warranty12 months
Ratings
Description
The Xilence CPU Thermal Pad XZ028 is engineered to deliver exceptional heat transfer from CPUs to cooling solutions, ensuring effective cooling and safeguarding sensitive hardware. Ideal for gamers and tech enthusiasts, this thermal interface material is user-friendly and straightforward in its application.
One of the key advantages of the Xilence CPU Thermal Pad is its excellent thermal conductivity of 22.5 ± 0.1 W/m·K. This feature guarantees that heat is transferred efficiently between CPU and cooling elements.
Other technical highlights include:
- Thermal Impedance: Less than 0.011 °C-in²/W, demonstrating minimal resistance to heat flow.
- Heat Resistance: 0.29 K/W, contributing to superb thermal management under load.
- Density: 2.6 g/cc, providing a balance of softness and durability.
- Operating Temperature Range: -40 °C to 125 °C, perfect for standard CPU environments.
- Storage Temperature Range: -50 °C to 250 °C, ensuring stability during long-term storage.
- Dimensions: 38 x 38 x 0.25 mm, designed to comfortably fit standard CPU surfaces.
- Weight: Approximately 44 grams per package, ensuring it’s lightweight and easy to handle.
- Warranty: 12 months, providing peace of mind regarding product reliability.
This thermal pad is classified under Xilence's cooling components, specifically tailored for CPUs. Its advanced thermal properties not only help maintain stable CPU temperatures but also enhance the longevity of hardware components.
In conclusion, the Xilence CPU Thermal Pad XZ028 is an indispensable choice for anyone seeking a reliable and high-performance solution for heat dissipation, coupled with straightforward application and solid thermal performance specifications.
Technical Specifications
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Thermal Conductivity22.5 ± 0.1 W/m·K
-
Thermal ImpedanceLess than 0.011 °C-in²/W
-
Heat Resistance0.29 K/W
-
Density2.6 g/cc
-
Operating Temperature Range-40 °C to 125 °C
-
Storage Temperature Range-50 °C to 250 °C
-
Dimensions38 x 38 x 0.25 mm
-
WeightApproximately 44 grams per package
-
Warranty12 months
