The Gelid GP-Extreme Thermal Pad TP-GP01-B is a high-performance thermal pad that effectively enhances thermal contact between heatsinks and uneven PCB surfaces. This product is part of the renowned GP-Extreme series, celebrated for its superior thermal conductivity and ease of application.

Designed specifically for components such as micro-controller units, memory ICs, analog ICs, and MOSFETs, this thermal pad excels in filling spaces efficiently to achieve optimal performance. Notably, it is non-electrical conductive, non-corrosive, non-curing, and non-toxic, ensuring its safety in various electronic applications.

Key Specifications

• Size: 80 mm x 40 mm - Ideal for large PCB surfaces.
• Thickness: 1.0 mm - Provides effective thermal transfer.
• Thermal Conductivity: 12 W/mK - Ensures efficient heat transfer.
• Density: 2.8 g/cm³ - Guarantees durability and effectiveness.
• Hardness: 35 Shore OO - Offers softness and flexibility.
• Dimensions: 80 mm x 40 mm x 1.0 mm - Compact and suitable for diverse applications.

For optimal use, removing the protective films from both sides before application is critical. Once installed, the thermal pad conforms to the heatsink and PCB shape and is not reusable, thus providing a reliable thermal interface.

In summary, the Gelid GP-Extreme Thermal Pad TP-GP01-B is an innovative thermal solution that enhances heat transfer in electronic devices. Its attributes make it suitable for a wide range of applications while ensuring safety and reliability.