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Thermal Paste Prolimatech PK-2 heat sink compound 10.2 W/m·K 30 g
εως 36 δόσεις με πιστωτική κάρτα
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4 installments 0% επιτόκιο, 20€ έως 300€
3 to 60 installments 300€ έως 100.00€
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The Prolimatech PK-2 Thermal Paste is engineered for optimal heat transfer between processors and heat sinks. This high-performance thermal compound is essential for ensuring that your CPU or GPU operates efficiently.
Key features and benefits:
- Thermal Conductivity: 10.2 W/m·K - efforts to reduce operating temperatures significantly.
- Specific Gravity: 2.5 g/cm³ - ensures consistency and ease of application.
- Adhesiveness: 250,000 Cps - facilitates a smooth and even layer.
- Thermal Impedance: 0.015 ?-in²/W - low resistance to heat flow.
- Dielectric Strength: 4 KV/mm - safe for sensitive electronic components.
- Material Composition: Includes aluminum, zinc oxide, oil, and antioxidant agents.
- Color: Grey.
- Viscosity: Low viscosity for fine spreading.
- Non-corrosive: Long-term stability to protect components.
- No burn-in time: Immediate maximum thermal performance.
The product includes a convenient 30 g syringe for easy application, making it an excellent choice for enthusiasts looking to optimize their heat management solutions.
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Thermal Conductivity10.2 W/m·K
-
Specific Gravity2.5 g/cm³
-
Adhesiveness250,000 Cps
-
Thermal Impedance0.015 ?-in²/W
-
Dielectric Strength4 KV/mm
-
Material Composition70-88% aluminum, 15-27% zinc oxide, 11-19% oil, 0.5-2% antioxidant agents
-
ColorGrey
-
ViscosityLow viscosity
-
Non-corrosiveYes
-
Burn-in Time RequiredNo
Ratings
Description
The Prolimatech PK-2 Thermal Paste is engineered for optimal heat transfer between processors and heat sinks. This high-performance thermal compound is essential for ensuring that your CPU or GPU operates efficiently.
Key features and benefits:
- Thermal Conductivity: 10.2 W/m·K - efforts to reduce operating temperatures significantly.
- Specific Gravity: 2.5 g/cm³ - ensures consistency and ease of application.
- Adhesiveness: 250,000 Cps - facilitates a smooth and even layer.
- Thermal Impedance: 0.015 ?-in²/W - low resistance to heat flow.
- Dielectric Strength: 4 KV/mm - safe for sensitive electronic components.
- Material Composition: Includes aluminum, zinc oxide, oil, and antioxidant agents.
- Color: Grey.
- Viscosity: Low viscosity for fine spreading.
- Non-corrosive: Long-term stability to protect components.
- No burn-in time: Immediate maximum thermal performance.
The product includes a convenient 30 g syringe for easy application, making it an excellent choice for enthusiasts looking to optimize their heat management solutions.
Technical Specifications
-
Thermal Conductivity10.2 W/m·K
-
Specific Gravity2.5 g/cm³
-
Adhesiveness250,000 Cps
-
Thermal Impedance0.015 ?-in²/W
-
Dielectric Strength4 KV/mm
-
Material Composition70-88% aluminum, 15-27% zinc oxide, 11-19% oil, 0.5-2% antioxidant agents
-
ColorGrey
-
ViscosityLow viscosity
-
Non-corrosiveYes
-
Burn-in Time RequiredNo
