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Thermal Paste Prolimatech PK-1 Nano Aluminium Thermal Compound - 30g
εως 36 δόσεις με πιστωτική κάρτα
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4 installments 0% επιτόκιο, 20€ έως 300€
3 to 60 installments 300€ έως 100.00€
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The Prolimatech PK-1 Nano Aluminium Thermal Compound - 30g is a premium-grade thermal paste designed for efficient heat transfer between CPUs or GPUs and their heatsinks. With a high thermal conductivity of 10.2 W/mK, this compound ensures excellent heat dissipation performance, making it ideal for serious hardware enthusiasts.
Key features include:
- Thermal conductivity: 10.2 W/mK, allowing rapid heat transfer to prevent thermal build-up.
- Thermal impedance/resistance: 0.017 °C·in²/W, indicating low thermal resistance between surfaces.
- Material composition: Made of nano aluminium particles (approximately 6085% aluminium content) combined with zinc oxide (ZnO), providing stability.
- Viscosity (Adhesiveness): Around 310000 Cps for strong adhesion.
- Color: Grey.
- Density: Approximately 3.2 g/cm³.
- Non-electrically conductive and non-corrosive, ensuring safety on electronic components.
This compound exhibits excellent long-term stability and low dry-out, maintaining top performance over extended periods. It is praised by hardware testers for its reliability, often outperforming other leading thermal pastes.
Additional features to note:
- Easy to spread, requiring less quantity for effective cooling.
- Consistent performance in various operating conditions.
- Convenient syringe format for precise dispensing.
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Thermal conductivity10.2 W/mK
-
Thermal impedance/resistance0.017 °C·in²/W
-
Material composition6085% aluminum content + Zinc Oxide (ZnO)
-
Viscosity (Adhesiveness)310000 Cps
-
ColorGrey
-
Density3.2 g/cm³
-
Non-electrically conductiveYes
-
Non-corrosiveYes
Ratings
Description
The Prolimatech PK-1 Nano Aluminium Thermal Compound - 30g is a premium-grade thermal paste designed for efficient heat transfer between CPUs or GPUs and their heatsinks. With a high thermal conductivity of 10.2 W/mK, this compound ensures excellent heat dissipation performance, making it ideal for serious hardware enthusiasts.
Key features include:
- Thermal conductivity: 10.2 W/mK, allowing rapid heat transfer to prevent thermal build-up.
- Thermal impedance/resistance: 0.017 °C·in²/W, indicating low thermal resistance between surfaces.
- Material composition: Made of nano aluminium particles (approximately 6085% aluminium content) combined with zinc oxide (ZnO), providing stability.
- Viscosity (Adhesiveness): Around 310000 Cps for strong adhesion.
- Color: Grey.
- Density: Approximately 3.2 g/cm³.
- Non-electrically conductive and non-corrosive, ensuring safety on electronic components.
This compound exhibits excellent long-term stability and low dry-out, maintaining top performance over extended periods. It is praised by hardware testers for its reliability, often outperforming other leading thermal pastes.
Additional features to note:
- Easy to spread, requiring less quantity for effective cooling.
- Consistent performance in various operating conditions.
- Convenient syringe format for precise dispensing.
Technical Specifications
-
Thermal conductivity10.2 W/mK
-
Thermal impedance/resistance0.017 °C·in²/W
-
Material composition6085% aluminum content + Zinc Oxide (ZnO)
-
Viscosity (Adhesiveness)310000 Cps
-
ColorGrey
-
Density3.2 g/cm³
-
Non-electrically conductiveYes
-
Non-corrosiveYes
