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Σκληρός Δίσκος M.2 SSD 512GB Team Group SSD MP33 - 2280 - PCIe 3.0 x4 NVMe
εως 36 δόσεις με πιστωτική κάρτα
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Έως 36 Δόσεις. Δείτε το πλάνο δόσεων:
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4 installments 0% επιτόκιο, 20€ έως 300€
3 to 60 installments 300€ έως 100.00€
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The Team Group SSD MP33 is a high-performance solid-state drive designed for both desktop and notebook users. It utilizes the latest M.2 2280 specification, ensuring compatibility with next-generation platforms of Intel and AMD.
Key Features:
- Interface and Protocol: Features a PCIe Gen3 x4 interface with NVMe 1.3 protocol for rapid data transfer rates.
- Memory Type: Employs new-generation 3D NAND flash memory for enhanced capacity, performance, and durability.
- Capacity and Dimensions: Available in various capacities. The 512GB model measures 80(L) x 22(W) x 3.8(H) mm and weighs only 6g.
- Operating Temperatures: Functions within 0°C to 70°C and can be stored between -40°C to 85°C.
Performance Specifications:
- Read/Write Speeds: Sequential read speeds up to 1,700 MB/s and write speeds up to 1,400 MB/s.
- Terabyte Written (TBW): 350 TBW for the 512GB model ensures a long lifespan.
Smart Management Mechanisms: Supports S.M.A.R.T and TRIM commands for enhanced efficiency and performance.
Warranty and Support: Comes with a 5-year limited warranty and free technical support service, ensuring users can rely on the SSD for an extended period.
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InterfacePCIe Gen3 x4
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ProtocolNVMe 1.3
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Memory Type3D NAND Flash
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Capacity512 GB
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Dimensions80(L) x 22(W) x 3.8(H) mm
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Weight6 g
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Operating Temperature Range0 to 70 °C
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Storage Temperature Range-40 to 85 °C
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Read Speed1700 MB/s
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Write Speed1400 MB/s
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TBW350
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MTBF1,500,000 hours
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Humidity ResistanceUp to 90% relative humidity
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Vibration Resistance80Hz to 2,000Hz with 20G acceleration
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Shock ResistanceUp to 1,500G with 0.5ms duration
Ratings
Description
The Team Group SSD MP33 is a high-performance solid-state drive designed for both desktop and notebook users. It utilizes the latest M.2 2280 specification, ensuring compatibility with next-generation platforms of Intel and AMD.
Key Features:
- Interface and Protocol: Features a PCIe Gen3 x4 interface with NVMe 1.3 protocol for rapid data transfer rates.
- Memory Type: Employs new-generation 3D NAND flash memory for enhanced capacity, performance, and durability.
- Capacity and Dimensions: Available in various capacities. The 512GB model measures 80(L) x 22(W) x 3.8(H) mm and weighs only 6g.
- Operating Temperatures: Functions within 0°C to 70°C and can be stored between -40°C to 85°C.
Performance Specifications:
- Read/Write Speeds: Sequential read speeds up to 1,700 MB/s and write speeds up to 1,400 MB/s.
- Terabyte Written (TBW): 350 TBW for the 512GB model ensures a long lifespan.
Smart Management Mechanisms: Supports S.M.A.R.T and TRIM commands for enhanced efficiency and performance.
Warranty and Support: Comes with a 5-year limited warranty and free technical support service, ensuring users can rely on the SSD for an extended period.
Technical Specifications
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InterfacePCIe Gen3 x4
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ProtocolNVMe 1.3
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Memory Type3D NAND Flash
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Capacity512 GB
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Dimensions80(L) x 22(W) x 3.8(H) mm
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Weight6 g
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Operating Temperature Range0 to 70 °C
-
Storage Temperature Range-40 to 85 °C
-
Read Speed1700 MB/s
-
Write Speed1400 MB/s
-
TBW350
-
MTBF1,500,000 hours
-
Humidity ResistanceUp to 90% relative humidity
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Vibration Resistance80Hz to 2,000Hz with 20G acceleration
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Shock ResistanceUp to 1,500G with 0.5ms duration
