Ψύκτρα CPU Cooler Master Hyper 212 PRO
| Installment plan | Amount / month |
|---|---|
| 2 | 20,10 € |
| 4 | 10,10 € |
| 6 | 6,77 € |
| 8 | 5,10 € |
| 10 | 4,11 € |
| 12 | 3,44 € |
| 18 | 2,33 € |
| 24 | 1,77 € |
| 36 | 1,22 € |
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Pickup from the store:El. Ave. Venizelou 73 (formerly Theseos), Kallithea
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Pick up from a BoxNow machine:With BoxNow you can pick up your parcel from an Automatic Pickup Machine that is near you at all hours of the day 24/7. Possibility of cash on delivery with an additional fee of €1
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Shipping to your location (Calculate shipping):
Detailed Description
The Cooler Master Hyper 212 PRO is a high-performance air CPU cooler designed to efficiently manage heat dissipation for modern processors, ensuring optimal system stability and performance.
The Hyper 212 PRO represents the latest evolution in Cooler Master’s acclaimed Hyper 212 series, featuring a redesigned all-new heat pipe that significantly enhances its thermal design power (TDP) capability to 230W. This allows for effective cooling of higher-powered CPUs.
Its innovative asymmetrical heat pipe layout guarantees 100% RAM clearance, ensuring ample space around the motherboard for tall memory modules without interference. Additionally, the cooler's optimized tower design improves airflow and heat dissipation for maximum cooling efficiency.
Aesthetically, it sports a sleek, modern all-new top cover, adding a professional and stylish look to any build. The included SickleFlow Edge 120mm fan is engineered for exceptional heat dissipation and includes ARGB lighting for visual appeal.
Installation is made easy with a simple and quick fan mounting system, ideal for both novice and experienced builders.
Specifications
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EAN Code
- 4719512156537
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MPN
- RR-212S-25PZ-R1
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Supported CPU Sockets
- Intel: LGA 1150, 1151, 1155, 1156, 1200, 1700, 1851; AMD: AM4, AM5
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TDP (Thermal Design Power)
- 230W
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Fan Size
- 120 mm
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Airflow
- Approximately 120 m³/h
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Heatsink Dimensions
- Approx. 125 x 74 x 152 mm (with fan)
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Heat Pipes
- Four superconductive composite heat pipes (SCHP) for enhanced heat transfer
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RAM Clearance
- 100% clearance due to asymmetrical heat pipe layout
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Fan Connection
- 4-pin PWM connector with ARGB header
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Cooling Technology
- Superconductive Composite Heat Pipes with specialized evaporator and condenser wick structures for superior heat dissipation
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Installation
- Easy fan mount system for quick setup
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Design Features
- Modern top cover design, ARGB lighting support
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