Intel Xeon Gold 6346 (S4189) - 16 cores / 32 threads, 3.1 GHz base, 3.6 GHz turbo, 205W, Tray
εως 36 δόσεις με πιστωτική κάρτα
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Έως 36 Δόσεις. Δείτε το πλάνο δόσεων:
TBI Bank
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4 installments 0% επιτόκιο, 20€ έως 300€
3 to 60 installments 300€ έως 100.00€
- 1. Ship with ACS Courier
- 2. Αποστολές με μεταφορικές εταιρίες για ογκώδη αντικείμενα
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3. Pickup from BoxNow automated machine:
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4. Pickup from the store:
Leof. El. Venizelou 73 (former Theseos), Kallithea
Συμπληρώστε τον ταχυδρομικό κωδικό για να λάβετε εκτίμηση τρόπου και κόστους μεταφορικών.
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BrandIntel
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ModelXeon Gold 6346
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SKU127381
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MPNCD8068904570201
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EAN8592978314446
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Socket4189
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Package TypeTray (OEM)
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Product TypeServer CPU
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MicroarchitectureIce Lake
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Cores16
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Threads32
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Base Frequency3.1 GHz
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Max Turbo Frequency3.6 GHz
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Cache (L3)36 MB
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Thermal Design Power (TDP)205 W
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Year Released2021
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Intel Optane SupportYes (persistent memory support, up to large capacities with PMem)
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Intel SGXYes (secure enclave support)
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Intel Speed Select (SST)Yes
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Intel Manageability Technologies (IMT)Yes
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Target UseServer, Data center, Cloud, Enterprise workloads
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OverclockableNo (not unlocked)
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Typical Package ContentsCPU (tray/processor only), no retail cooler
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MaterialSilicon die with integrated heat spreader (IHS) metal
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Typical DeploymentDual-socket or single-socket server platforms depending on motherboard
Ratings
Description
Technical Specifications
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BrandIntel
-
ModelXeon Gold 6346
-
SKU127381
-
MPNCD8068904570201
-
EAN8592978314446
-
Socket4189
-
Package TypeTray (OEM)
-
Product TypeServer CPU
-
MicroarchitectureIce Lake
-
Cores16
-
Threads32
-
Base Frequency3.1 GHz
-
Max Turbo Frequency3.6 GHz
-
Cache (L3)36 MB
-
Thermal Design Power (TDP)205 W
-
Year Released2021
-
Intel Optane SupportYes (persistent memory support, up to large capacities with PMem)
-
Intel SGXYes (secure enclave support)
-
Intel Speed Select (SST)Yes
-
Intel Manageability Technologies (IMT)Yes
-
Target UseServer, Data center, Cloud, Enterprise workloads
-
OverclockableNo (not unlocked)
-
Typical Package ContentsCPU (tray/processor only), no retail cooler
-
MaterialSilicon die with integrated heat spreader (IHS) metal
-
Typical DeploymentDual-socket or single-socket server platforms depending on motherboard