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The Fibocom L850 GL is a high-speed LTE Cat9 M.2 wireless WWAN cellular module built around the Intel XMM 7360 chipset, designed for laptops, tablets, and gateways with global LTE coverage. It supports LTE FDD downlink speeds up to 450 Mbps and uplink speeds up to 50 Mbps, or LTE TDD up to 347 Mbps...
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Fibocom L850 GL Wireless Cellular Modem
Product Code: 1200659291
Available in 4 - 10 days
267,67 €
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8,36€ / month
εως 36 δόσεις με πιστωτική κάρτα
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Έως 36 Δόσεις. Δείτε το πλάνο δόσεων:
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4 installments 0% επιτόκιο, 20€ έως 300€
3 to 60 installments 300€ έως 100.00€
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The Fibocom L850 GL is a high-speed LTE Cat9 M.2 wireless WWAN cellular module built around the Intel XMM 7360 chipset, designed for laptops, tablets, and gateways with global LTE coverage. It supports LTE FDD downlink speeds up to 450 Mbps and uplink speeds up to 50 Mbps, or LTE TDD up to 347 Mbps downlink and 30 Mbps uplink, with fallback support for HSPA+ and UMTS. The module uses an M.2 Key-B interface and supports PCIe, I2C, I2S, GPIO, SIM, and two U.FL RF antenna connectors. It is identified by SKU and MPN 01AX792 / L850 GL, and is commonly used as an embedded mobile broadband solution in business notebooks and OEM platforms. Physical dimensions are approximately 30 x 42 x 2.3 mm, with an estimated weight of 6.2 g. Supported LTE FDD bands include 1, 2, 3, 4, 5, 7, 8, 11, 12, 13, 17, 18, 19, 20, 21, 26, 28 or 29, 30, and 66; LTE TDD bands include 38, 39, 40, and 41; WCDMA bands include 1, 2, 4, 5, and 8. Features include GNSS support, SMS in MO and MT modes, proprietary and standard AT command support, broad OS compatibility, and global carrier certification. Typical power supply is 3.135 V to 4.4 V, with 3.3 V nominal.
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BrandFibocom
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ModelL850 GL
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MPN01AX792
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SKU01AX792
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Product TypeWireless cellular modem WWAN module
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Form FactorM.2 Key B
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ChipsetIntel XMM 7360 LTE modem
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CategoryLTE Cat9 embedded cellular module
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LTE FDD SpeedUp to 450 Mbps downlink and 50 Mbps uplink
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LTE TDD SpeedUp to 347 Mbps downlink and 30 Mbps uplink
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3G FallbackHSPA+ and UMTS
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Supported LTE FDD Bands1, 2, 3, 4, 5, 7, 8, 11, 12, 13, 17, 18, 19, 20, 21, 26, 28 or 29, 30, 66
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Supported LTE TDD Bands38, 39, 40, 41
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Supported WCDMA Bands1, 2, 4, 5, 8
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InterfacePCIe, I2C, I2S, GPIO, SIM
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RF Connectors2 x U.FL antenna connectors
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GNSSSupported
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SMSMO and MT text and PDU modes
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OS CompatibilityWindows 10, Linux, Android
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Power Supply3.135 V to 4.4 V nominal 3.3 V
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Sleep CurrentLess than 6 mA in DRX9
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Operating Temperature-20 C to 65 C extended
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Storage Temperature-40 C to 85 C
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Dimensions30 x 42 x 2.3 mm
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WeightApproximately 6.2 g
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CertificationsGlobal CE CCC FCC GCF PTCRB and carrier approvals
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Typical UseLaptops tablets and gateways
Ratings
Description
The Fibocom L850 GL is a high-speed LTE Cat9 M.2 wireless WWAN cellular module built around the Intel XMM 7360 chipset, designed for laptops, tablets, and gateways with global LTE coverage. It supports LTE FDD downlink speeds up to 450 Mbps and uplink speeds up to 50 Mbps, or LTE TDD up to 347 Mbps downlink and 30 Mbps uplink, with fallback support for HSPA+ and UMTS. The module uses an M.2 Key-B interface and supports PCIe, I2C, I2S, GPIO, SIM, and two U.FL RF antenna connectors. It is identified by SKU and MPN 01AX792 / L850 GL, and is commonly used as an embedded mobile broadband solution in business notebooks and OEM platforms. Physical dimensions are approximately 30 x 42 x 2.3 mm, with an estimated weight of 6.2 g. Supported LTE FDD bands include 1, 2, 3, 4, 5, 7, 8, 11, 12, 13, 17, 18, 19, 20, 21, 26, 28 or 29, 30, and 66; LTE TDD bands include 38, 39, 40, and 41; WCDMA bands include 1, 2, 4, 5, and 8. Features include GNSS support, SMS in MO and MT modes, proprietary and standard AT command support, broad OS compatibility, and global carrier certification. Typical power supply is 3.135 V to 4.4 V, with 3.3 V nominal.
Technical Specifications
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BrandFibocom
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ModelL850 GL
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MPN01AX792
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SKU01AX792
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Product TypeWireless cellular modem WWAN module
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Form FactorM.2 Key B
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ChipsetIntel XMM 7360 LTE modem
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CategoryLTE Cat9 embedded cellular module
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LTE FDD SpeedUp to 450 Mbps downlink and 50 Mbps uplink
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LTE TDD SpeedUp to 347 Mbps downlink and 30 Mbps uplink
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3G FallbackHSPA+ and UMTS
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Supported LTE FDD Bands1, 2, 3, 4, 5, 7, 8, 11, 12, 13, 17, 18, 19, 20, 21, 26, 28 or 29, 30, 66
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Supported LTE TDD Bands38, 39, 40, 41
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Supported WCDMA Bands1, 2, 4, 5, 8
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InterfacePCIe, I2C, I2S, GPIO, SIM
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RF Connectors2 x U.FL antenna connectors
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GNSSSupported
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SMSMO and MT text and PDU modes
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OS CompatibilityWindows 10, Linux, Android
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Power Supply3.135 V to 4.4 V nominal 3.3 V
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Sleep CurrentLess than 6 mA in DRX9
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Operating Temperature-20 C to 65 C extended
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Storage Temperature-40 C to 85 C
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Dimensions30 x 42 x 2.3 mm
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WeightApproximately 6.2 g
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CertificationsGlobal CE CCC FCC GCF PTCRB and carrier approvals
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Typical UseLaptops tablets and gateways
