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AMD EPYC 7203P (Zen 3) server processor in Tray packaging. 8 physical cores and 16 threads. Base frequency 2.8 GHz with max boost up to 3.4 GHz. 64 MB cache. Thermal Design Power (TDP) 120 W. Socket SP3. Tray package (no cooler included). Designed for servers, workstations, HPC and heavy I/O...
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AMD EPYC 7203P 8-Core (16-Thread) SP3 Tray
Product Code: 1173725724
Available in 4 - 6 days
423,06 €
or
13,21€ / month
εως 36 δόσεις με πιστωτική κάρτα
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Έως 36 Δόσεις. Δείτε το πλάνο δόσεων:
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4 installments 0% επιτόκιο, 20€ έως 300€
3 to 60 installments 300€ έως 100.00€
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AMD EPYC 7203P (Zen 3) server processor in Tray packaging. 8 physical cores and 16 threads. Base frequency 2.8 GHz with max boost up to 3.4 GHz. 64 MB cache. Thermal Design Power (TDP) 120 W. Socket SP3. Tray package (no cooler included). Designed for servers, workstations, HPC and heavy I/O workloads. Release year: 2023. Not unlocked for manual overclocking. Supports ECC memory and multi-channel memory configurations.
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BrandAMD
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ModelEPYC 7203P
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SeriesEPYC 7003 (Milan)
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MicroarchitectureZen 3
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Cores8
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Threads16
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Base Frequency2.8 GHz
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Max/Boost Frequency3.4 GHz
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Cache64 MB
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SocketSP3
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TDP120 W
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PackageTray (no cooler included)
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Intended UseServer & Workstation (HPC, high I/O)
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Memory Channels8-channel
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Memory SupportECC memory supported
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PCIePCIe 4.0, up to 128 lanes
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Release Year2023
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Unlocked/OverclockingNo (locked)
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Form FactorLGA/SP3 server processor
Ratings
Description
AMD EPYC 7203P (Zen 3) server processor in Tray packaging. 8 physical cores and 16 threads. Base frequency 2.8 GHz with max boost up to 3.4 GHz. 64 MB cache. Thermal Design Power (TDP) 120 W. Socket SP3. Tray package (no cooler included). Designed for servers, workstations, HPC and heavy I/O workloads. Release year: 2023. Not unlocked for manual overclocking. Supports ECC memory and multi-channel memory configurations.
Technical Specifications
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BrandAMD
-
ModelEPYC 7203P
-
SeriesEPYC 7003 (Milan)
-
MicroarchitectureZen 3
-
Cores8
-
Threads16
-
Base Frequency2.8 GHz
-
Max/Boost Frequency3.4 GHz
-
Cache64 MB
-
SocketSP3
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TDP120 W
-
PackageTray (no cooler included)
-
Intended UseServer & Workstation (HPC, high I/O)
-
Memory Channels8-channel
-
Memory SupportECC memory supported
-
PCIePCIe 4.0, up to 128 lanes
-
Release Year2023
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Unlocked/OverclockingNo (locked)
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Form FactorLGA/SP3 server processor
