The NOD TP-5WB Thermal Paste is a high-quality thermal interface material designed to enhance heat dissipation between electronic components and their cooling systems. This paste is particularly suitable for use in CPUs, GPUs, and other heat-generating components. It is formulated to provide excellent thermal conductivity and low thermal impedance, ensuring efficient heat transfer and maintaining optimal component temperatures.

Key Features:

• Enhances heat dissipation
• Reduces thermal resistance
• Compatible with CPUs and GPUs
• Improves overall system reliability

The NOD TP-5WB is designed for use in various applications where efficient heat management is crucial. It helps in filling microscopic gaps between the component and the heat sink, thus improving overall system performance and longevity.

Technical Specifications:

• Grease Color: Gray
• Grease Weight: 5g
• Thermal Impedance: 0.03°C·cm²/W
• Thermal Conductivity: 6.2 W/m·K
• Specific Gravity (25°C): Not specified

For optimal performance, it is recommended to apply a thin layer of the paste to the component's surface before attaching the heat sink. This ensures that the thermal interface material is evenly distributed and maximizes its effectiveness in dissipating heat.

By using the NOD TP-5WB Thermal Paste, users can expect improved cooling efficiency, reduced thermal throttling, and enhanced overall system reliability.