Thermal Paste Prolimatech PK-2 heat sink compound 10.2 W/m·K 30 g

Installment plan | Amount / month |
---|---|
2 | 25,75 € |
4 | 12,94 € |
6 | 8,67 € |
8 | 6,54 € |
10 | 5,26 € |
12 | 4,41 € |
18 | 2,98 € |
24 | 2,27 € |
36 | 1,56 € |

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Pickup from the store:El. Ave. Venizelou 73 (formerly Theseos), Kallithea
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Pick up from a BoxNow machine:With BoxNow you can pick up your parcel from an Automatic Pickup Machine that is near you at all hours of the day 24/7. Possibility of cash on delivery with an additional fee of €1
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Shipping to your location (Calculate shipping):
Detailed Description
The Prolimatech PK-2 Thermal Paste is engineered for optimal heat transfer between processors and heat sinks. This high-performance thermal compound is essential for ensuring that your CPU or GPU operates efficiently.
Key features and benefits:
- Thermal Conductivity: 10.2 W/m·K - efforts to reduce operating temperatures significantly.
- Specific Gravity: 2.5 g/cm³ - ensures consistency and ease of application.
- Adhesiveness: 250,000 Cps - facilitates a smooth and even layer.
- Thermal Impedance: 0.015 ?-in²/W - low resistance to heat flow.
- Dielectric Strength: 4 KV/mm - safe for sensitive electronic components.
- Material Composition: Includes aluminum, zinc oxide, oil, and antioxidant agents.
- Color: Grey.
- Viscosity: Low viscosity for fine spreading.
- Non-corrosive: Long-term stability to protect components.
- No burn-in time: Immediate maximum thermal performance.
The product includes a convenient 30 g syringe for easy application, making it an excellent choice for enthusiasts looking to optimize their heat management solutions.
Specifications
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Thermal Conductivity
- 10.2 W/m·K
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Specific Gravity
- 2.5 g/cm³
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Adhesiveness
- 250,000 Cps
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Thermal Impedance
- 0.015 ?-in²/W
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Dielectric Strength
- 4 KV/mm
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Material Composition
- 70-88% aluminum, 15-27% zinc oxide, 11-19% oil, 0.5-2% antioxidant agents
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Color
- Grey
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Viscosity
- Low viscosity
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Non-corrosive
- Yes
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Burn-in Time Required
- No